Creating Innovative and Reliable Circuits Using Inventive Topologies and Semi Conductors (CIRCUITS) | DE FOA 0001727

FAQs: ARPA-E CIRCUITS Program (DOE)

1) What is the ARPA-E CIRCUITS program?

CIRCUITS is a Department of Energy ARPA-E program focused on achieving a step change (not incremental gains) in power electronics performance. The program targets next-generation power converters that are simultaneously more efficient, smaller and lighter, and more reliable.

2) What problem is this funding opportunity trying to solve?

The opportunity is designed to improve how electricity is converted and used across major sectors (transportation, industry, buildings, and the electric grid). ARPA-E positions better power electronics as strategically important for US economic and energy security, with downstream benefits such as reduced energy waste and lower emissions.

3) What is the main technical idea behind CIRCUITS?

CIRCUITS is built around the idea that wide bandgap (WBG) semiconductors (for example, silicon carbide and gallium nitride devices) can enable major gains, but only if the overall converter system is redesigned to fully exploit them. The focus is on system-level innovation rather than improving semiconductor devices in isolation.

4) What does ARPA-E mean by "system-level" innovation in this program?

System-level innovation means co-optimizing the converter architecture (circuit topology), the gate drive and control approach, and the physical packaging so they work together as an integrated design. The goal is for WBG-based converters to operate effectively at high switching frequencies and high temperatures while keeping losses low.

5) Why are wide bandgap (WBG) semiconductors important to this program?

ARPA-E highlights WBG semiconductors because they offer the potential for higher switching frequency and higher temperature operation. CIRCUITS is specifically seeking approaches that allow those advantages to be realized at the full converter level, including managing losses, parasitics, and reliability.

6) What are the main technical areas of interest under CIRCUITS?

ARPA-E identifies three primary areas of interest:

• Novel circuit topologies (new converter architectures that better exploit fast-switching WBG devices and reduce parasitic effects, losses, and component stress)
• Advanced control and drive electronics (gate drivers and control strategies for clean high-speed switching, stability, and protection under real operating conditions)
• Innovative packaging (solutions addressing thermal management, interconnect inductance, insulation, and layout to enable reliable high-frequency, high-temperature performance)

7) What kinds of converter designs is the program looking for?

The program is looking for designs where topology, gate drive/control, and packaging are developed together rather than treated as separate plug-and-play components. The intent is to reduce parasitics and losses and improve performance and reliability when operating at high frequency and high temperature.

8) Why does CIRCUITS emphasize packaging as a core innovation area?

ARPA-E emphasizes packaging because thermal management, interconnect inductance, insulation, and physical layout often determine whether high-frequency, high-temperature performance is feasible in a reliable, real-world product. Packaging can be a limiting factor even when semiconductor devices are capable.

9) What outcomes or benefits does ARPA-E expect improved power converters to deliver?

ARPA-E anticipates that better converters can reduce energy waste by lowering conversion losses and can also enable broader electrification and improved system efficiency. These changes can translate into energy savings and associated emissions reductions.

10) Which applications does ARPA-E call out for CIRCUITS technologies?

ARPA-E highlights a wide range of applications where power converters are essential, including motor drives, automotive power electronics, power supplies, data centers, aerospace, ship propulsion, rail, distributed energy resources, and grid equipment.

11) What adoption barriers is the program trying to address?

The program stresses that performance alone is not enough for adoption. Even efficient devices can struggle to gain traction if they are difficult to cool, hard to control, unreliable at scale, or too bulky for the target platform. CIRCUITS addresses these constraints by targeting efficiency, reliability, and form factor together.

12) What kind of federal funding mechanism is used for awards?

Awards are made as cooperative agreements. This typically indicates more active federal involvement in project execution compared with a standard grant.

13) What type of opportunity is this administratively?

This is a discretionary DOE opportunity issued as a Funding Opportunity Announcement (FOA) by ARPA-E under its authorizing statute (42 U.S.C. 16538).

14) What is the CFDA number associated with this opportunity?

The opportunity is listed under CFDA 81.135 (Science and Technology and Other Research and Development).

15) Who is eligible to apply?

Eligibility is described as unrestricted, meaning a wide range of entity types may apply, subject to any specific clarifications in the FOA.

16) How many awards does ARPA-E expect to make?

ARPA-E anticipated making roughly 12 awards.

17) What is the maximum award size (award ceiling)?

The award ceiling is up to $10,000,000 per project.

18) What is the required submission process?

The solicitation process required submission of a concept paper through ARPA-E's eXCHANGE system, and submissions had to be made only through that system.

19) When were concept papers due, and what time zone applies?

Concept papers were due by 5:00 p.m. Eastern Time on the listed deadline in the solicitation materials.

20) Did ARPA-E provide any timing recommendations for submission?

Yes. ARPA-E advised submitting at least 48 hours early to avoid last-minute system or validation issues.

21) Where can applicants find the official requirements and evaluation details?

Full details (required content, evaluation criteria, and submission instructions) are provided in the FOA posted on the ARPA-E FOA website and supported by the ARPA-E eXCHANGE user guide.

22) Is the program focused only on improving semiconductor devices?

No. CIRCUITS explicitly targets system-level innovations across the full converter stack. ARPA-E notes that many prior efforts emphasized semiconductor materials and device improvements while leaving conventional converter architectures largely intact.

23) What operating conditions are emphasized for CIRCUITS converter designs?

The program emphasizes making WBG-based converters operate effectively at high switching frequencies and high temperatures while maintaining low losses and high reliability.

24) What aspects of converter performance are being pursued at the same time?

The program seeks converters that are more efficient, smaller and lighter, and more reliable simultaneously, reflecting real-world deployment needs across multiple platforms and sectors.